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반도체-삼성전자-하이닉스-마이크론

메모리 가격은 2021년3분기에 2자리수 상승 예상

2021.05.24

Highlights of the day: Memory contract prices set for double-digit increases in 3Q21 (digitimes.com)

 

Memory prices have been rising, and contract quotes for DRAM and NAND flash are expected to see double-digit increases in the third quarter of 2021. 

2021년3분기 디램과 낸드 가격은 2분기대비 2자리수 상승할 것으로 예상된다.

 

Backend service providers are also looking to raise fees in the third quarter to reflect rising material costs. In the handset market, sales in China and India may be weak, but the makers in the handset supply chain are still optimistic about the market in the second half of 2021.

후공정업체들(반도체 패키징)도 소재 가격 상승으로 후공정 가격을 올맇 것으로 예상된다.

스마트폰 시장에서 중국과 인도 시장 매출이 약할지도 모르지만, 스마트폰 공급망에서는 2021년하반기 시장에대해 낙관적이다.

 

 

OSATs may further hike service quotes in 3Q21

Taiwan OASTs are expected to enforce a new round of quote hikes in the third quarter of the year to reflect ever-rising prices for raw materials particularly for QFN wire-bonding process, according to industry sources.

www.digitimes.com

Memory contract prices to see double-digit gains in 3Q21: DRAM and NAND flash memory contract prices are set to register double-digit increases in the third quarter of 2021, according to industry sources.

 

OSATs may further hike service quotes in 3Q21: Taiwan OASTs are expected to enforce a new round of quote hikes in the third quarter of the year to reflect ever-rising prices for raw materials particularly for QFN wire-bonding process, according to industry sources.

대만의 외주 후공정업체들은 와이어 본딩등 소재 물질의 원가 상승으로 인하여 어쩔수없이

3분기에 새로운 가격 상승을 할것으로 예상한다.

 

Handset supply chain makers remain optimistic about 2H21: Taiwan-based upstream and downstream handset supply chain makers have remained optimistic about their business outlook for the third quarter of 2021 despite a slew of negative developments, including shortages of components, tight capacity, and rising material prices.

스마트폰 공급망 업체들은 2021년 하반기에 낙관적이다.