2022.06.22
Notebook sales to pick up in 3Q22 (digitimes.com)
Notebook sales are expected to pick up starting in the third quarter of 2022, driven by post-lockdown recovery,
according to industry sources.
2022년3분기 노트북 출하량은 코로나 봉쇄 해제로 증가할 것이라고 업계관계자는 예상했다.
2022.06.21
Easing chip shortages to boost PS5 console shipments (digitimes.com)
The easing of chip and component shortages will boost shipments of Sony's PlayStation 5 (PS5) gaming consoles
in the second half of 2022 and 2023, according to industry sources.
2022년하반기에는 반도체와 부품 부족이 완화됨에 따라 소니의 플레이스테이션5의
출하량이 증가할 것으로 업계 관계자는 예상했다.
2022.06.22
Global game console shipments are expected to reach around 55-58 million units in 2022 and may rise further in 2023.
2022년 글로벌 게임기 출하량은 55백만-58백만대에 달하고, 2023년에는 더 많을 것.
2022.06.21
자동차 반도체 부족은 2023년 하반기까지 계속될 듯.
Automotive MCU supply to stay tight through 2H23 (digitimes.com)
The supply of automotive MCUs is expected to stay tight through the second half of 2023, according to industry sources.
업계 소식통에 따르면 자동차 MCU의 공급은 2023년 하반기까지 타이트하게 유지될 것으로 예상됩니다.
Despite the sharp decline in consumer electronics demand, the electrification of vehicles is driving the use of electronics in vehicles.
소비자 가전 수요의 급격한 감소에도 불구하고 차량의 전기화로 인해 차량에 전자 제품이 사용되는 추세입니다.
Demand for key automotive microcontroller units (MCU) continues to be hot. Leading Taiwan-based semiconductor manufacturers estimate a single vehicle needs 20-30 MCUs. In the future, luxury vehicle models may need up to 100 MCUs, which is higher than the previously estimated 70 units.
주요 자동차 마이크로컨트롤러 유닛(MCU)에 대한 수요는 계속해서 뜨겁습니다.
대만에 기반을 둔 선도적인 반도체 제조업체는 단일 차량에 20-30개의 MCU가 필요한 것으로 추정합니다.
미래에는 고급 차량 모델에 최대 100개의 MCU가 필요할 수 있으며, 이는 이전에 추정된 70개보다 많은 수치입니다.
Supply chains expect tier-1 IDMs such as Infineon, STMicroelectronics (STM), and NXP Semiconductors to extend delivery times and accelerate outsourcing. Supply and demand of automotive MCUs is expected to remain tight through the second half of 2023, which is good news for outsourced assembly and testing (OSAT) vendors.
공급망은 Infineon, STMicroelectronics(STM) 및 NXP Semiconductors와 같은 Tier-1 IDM이 배송 시간을 연장하고
아웃소싱을 가속화할 것으로 기대합니다. 자동차 MCU의 수급은 2023년 하반기까지 타이트하게 유지될 것으로 예상되며, 이는 OSAT(아웃소싱 조립 및 테스트) 공급업체에게 희소식입니다.
Taiwan-based OSAT ASE Group is expected to greatly benefit, as this will effectively alleviate the decline in its packaging and testing business from consumer electronics. According to the sources, the bulk of outsourced packaging orders from IDMs have gone to ASE Semiconductor, with few going to Siliconware Precision Industries (SPIL), under ASE Group. On the testing side, in addition to ASE Group, orders have gone to Ardentec, King Yuan Electronics (KYEC), and Terapower Technology.
대만에 기반을 둔 후공정업체 ASE Group은 소비자 전자 제품에서 패키징 및 테스트 사업의 감소를 효과적으로
완화할 것이기 때문에 큰 혜택을 받을 것으로 예상됩니다.
소식통에 따르면 IDM(종합반도체 회사)에서 아웃소싱된 패키징 주문의 대부분은 ASE 로 이동했으며
ASE Group 산하의 SPIL(Siliconware Precision Industries)로 이동하는 것은 거의 없었습니다.
테스트 측면에서 ASE 그룹 외에도 Ardentec, King Yuan Electronics(KYEC) 및 Terapower Technology에
주문이 들어갔습니다.
While some automotive MCU product lines are using the 5nm advanced process, the most used with the tightest supplies are the 28nm and 40nm processes. The main packaging processes used are traditional wire bonding quad flat no-lead (QFN) and quad flat package (QFP). Companies expected to excel in 2022-2023 are those that are able to win IDM orders.
Despite the significant fluctuations in the consumer electronics market, industrial control MCUs have seen relatively stable demand. Mid-sized MCU packaging and testing vendors said the visibility of consumer-related bulk products for MCU companies in Taiwan and China is unclear in second-half 2022; however, there is more certainty for order visibility of B2B, industrial control, and commercial products.
Demand for industrial controls will continue to rise as the world moves toward energy savings, carbon reduction, and a green economy, as well as with the remote and automation trends driven by the pandemic. Major international IDMs are also launching new MCU products for industrial control Internet of Things (IoT) that are compatible with edge computing. For example, NXP is promoting its MCX series for smart home and IoT edge applications. The MCX series integrates a new neural processing unit (NPU) that accelerates edge inference and can deliver up to 30-times faster machine learning throughput.
The industry expects major IDMs will focus on the automotive and industrial control sectors in the coming two years, and lock in high-margin product lines. The supply and demand gap in high-end consumer products and the uncertainty shrouding the overall consumer market are things Taiwanese chip makers should pay attention to.
However, seizing bulk outsourcing business from IDMs will allow the IC supply chain, such as wafer production and backend packaging and testing vendors, to maintain steady performance and possibly even grow by making up for declining consumer electronics demand.
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