8인치 웨이퍼 생산용량 부족으로 반도체 부족 사태 지속(2022.02.08)

2022.02.08

DRAMeXchange - 【Market View】8-inch Wafer Capacity Remains Tight, Shortages Expected to Ease in 2H23, Says TrendForce

 

8-inch Wafer Capacity Remains Tight, Shortages Expected to Ease in 2H23, Says TrendForce

8인치 웨이퍼 생산용량 부족으로 반도체 부족 사태는 2023년하반기까지 지속될 것.

 

From 2020 to 2025, the compound annual growth rate (CAGR) of 12-inch equivalent wafer capacity at the world's top ten foundries will be approximately 10% with the majority of these companies focusing on 12-inch capacity expansion, which will see a CAGR of approximately 13.2%, according to TrendForce’s research.

 

2020년부터 2025년까지 글로벌 상위 10개 파운드리 업체의 12인치 생산용량은 연율 10%정도로 증가할 것이라고

트렌드포스는 분석했지만 우리는 거의 13.2%의 증가를 볼것이다..

 

In terms of 8-inch wafers, due to factors such as difficult to obtain equipment and whether capacity expansion is cost-effective, most fabs can only expand production slightly by means of capacity optimization, equating to a CAGR of only 3.3%.

 

대부분 8인치 공장은 장비 구입의 어려움과 공장 확장이 투자대비 효율적인가 때문에 설비투자대신에

설비 효율화를 통해서 생산량을 연율 3.3% 수준으로 조금씩 증가시키고 있다.

 

In terms of demand, the products primarily derived from 8-inch wafers, PMIC and Power Discrete, are driven by demand for electric vehicles, 5G smartphones, and servers.

 

수요측면에서 전력반도체나 파워 디스크리트같은 8인치 공정에서 생사되는 제품은

전기차, 5g스마트폰과 서버용이었다.

 

Stocking momentum has not fallen off, resulting in a serious shortage of 8-inch wafer production capacity that has festered since 2H19.

재고쌓기 모멘텀이 꺾이지 않아 2019년 하반기부터 악화된 8인치 웨이퍼 생산능력의 심각한

부족 현상이 나타나고 있다.

 

Therefore, in order to mitigate competition for 8-inch capacity, a trend of shifting certain products to 12-inch production has gradually emerged. However, if shortages in overall 8-inch capacity is to be effectively alleviated,

it is still necessary to wait for a large number of mainstream products to migrate to 12-inch production.

The timeframe for this migration is estimated to be close to 2H23 into 2024.

 

따라서 8인치 용량 경쟁을 완화하기 위해, 일부 제품을 12인치 생산으로 옮기는 추세가 점차 나타나고 있다.

그러나 전체 8인치 용량 부족을 효과적으로 완화하려면 여전히 다수의 주류 제품이 12인치 생산으로 전환될 때까지

기다려야 한다.

이 전환의 기간은 2H23에서 2024년 사이일 것으로 추정됩니다.

 

PMIC and Audio Codec gradually transferred to 12-inch production, alleviating shortage of 8-inch production capacity

PMIC·오디오 코덱 점차 12인치 생산으로 전환, 8인치 생산능력 부족 해소

 

At present, mainstream products produced using 8-inch wafers include large-sized panel Driver IC, CIS, MCU, PMIC, Power Discrete (including MOSFET, IGBT), Fingerprint, Touch IC, and Audio Codec. Among them, there are plans to gradually migrate Audio Codec and some more severely backordered PMICs to the 12-inch process.

In terms of PMICs, other than certain PMICs used in Apple iPhones already manufactured at 12-inch 55nm, most mainstream PMIC processes are still at 8-inch 0.18-0.11μm. Burdened with the long-term supply shortage, IC design companies including Mediatek, Qualcomm, and Richtek have successively planned to transfer some PMICs to 12-inch 90/55nm production. However, since product process conversion requires time-consuming development and verification and total current production capacity of the 90/55nm BCD process is limited, short term relief to 8-inch production capacity remains small. Effective relief is expected in 2024 when large swathes of mainstream products migrate to 12-inch production.

In terms of Audio Codec, Audio Co

decs for laptops are primarily manufactured on 8-inch wafers, and Realtek is the main supplier. In the 1H21, the squeeze on capacity delayed lead times which affected notebook computers shipments. Although the stocking efforts of certain tier1 customers proceeded smoothly in the second half of the year, these products remained difficult to obtain for some small and medium-sized customers. At present, Realtek has partnered with Semiconductor Manufacturing International Corporation (SMIC) to transfer the process development of laptop Audio Codecs from 8-inch to 12-inch 55nm. Mass production is forecast for mid-2022 and is expected to improve Audio Codec supply.

 

In addition to PMIC/Power Discrete, another mainstream product derived from 8-inch manufacturers is the large-sized panel Driver IC. Although most fabs still manufacture 8-inch wafers, Nexchip provides a 12-inch 0.11-0.15μm process technology used to produce large-sized Driver ICs. As production capacity at Nexchip grows rapidly, the supply of this product has been quite smooth. However, TrendForce believes that this is a special case. Mainstream large-sized Driver ICs are still manufactured on 8-inch wafers and there is no trend to switch to 12-inch wafers.

 

PMIC/Power Discrete 외에도 8인치 제조업체에서 파생된 또 다른 주류 제품은 대형 패널 드라이버 IC입니다.

대부분의 팹이 여전히 8인치 웨이퍼를 제조하지만 Nexchip은 대형 드라이버 IC를 생산하는 데 사용되는 12인치 0.11-0.15μm 공정 기술을 제공합니다.

Nexchip의 생산 능력이 급격히 증가함에 따라이 제품의 공급은 매우 원활했습니다.

그러나 TrendForce는 이것이 특별한 경우라고 생각합니다.

주류인 대형 Driver IC는 여전히 8인치 웨이퍼로 제조되며 12인치 웨이퍼로 전환하는 경향이 없습니다.