낸드 제조사들은 200단이상 경쟁(2022.02.02)

2022.02.02

NAND flash vendors to enter race for 200-plus-layer offerings (digitimes.com)

 

NAND flash vendors are all poised to introduce their 200-plus-layer chip offerings between the end of 2022 and 2023, a milestone for the industry in transitioning to higher-density 3D NAND flash memory.

 

낸드 제조사들은 2022년말과 2023년초 사이에 고용량 3D낸드로 전환의 산업의 기념비적인

200단 낸드를 선보이려 하고있다.

 

Among the vendors, Samsung Electronics and Micron Technology could be the first racing to kick off volume production of 200-plus-layer 3D NAND flash chips, the sources said.

 

제조사들 사이에는 삼성과 마이크론이 200단 3D낸드 양산의 첫번째 주자가 될것으로 예상하고 있다.

 

Samsung kicked off production at its new fab in Pyeongtaek, South Korea during the second half of 2021, and will step up its 176-layer 3D NAND chip output at the fab this year, the sources indicated. Transitioning to 176-layer 3D NAND flash manufacturing is expected to boost Samsung's total output at the new fab to 50,000 wafers monthly in 2022, the sources noted.

 

삼성은 2021년 하반기 한국의 평택공장에서 176단 3D낸드 생산 준비를 했다.

176단 3D낸드 생산은 2022년 월5만장 정도가 될것이다.

 

Samsung has been also stepping up its 128-layer 3D NAND chip output at its Xi'an plan in China, where the vendor is constructing the phase-two facility of the plant designed for monthly output of 130,000-140,000 wafers, the sources said. Samsung is capable of processing 120,000 wafers monthly at its phase-one facility of the plant.

 

삼성은 중국 시안2공장에서 128단 3D낸드를 생산하고 있으며, 월13만장에서 14만장 생산 수준의 제2공장을

건설하고 이다. 삼성의 제1공장 생산 능력은 월12만장 정도이다.

 

Samsung's Xi'an plant will be key determining its pricing strategy as a substantial output ramp-up at the fab will help lower the vendor's overall production costs significantly, the sources believe. The vendor's capability of more than doubling its output at the fab will also make a positive contribution to its further market leadership.

 

삼성 시안공장은 생산 단가를 낮추는데 도움이되는 가격 정책면에서 중요 결정처이다.

시안 공장의 생산력이 2배가 되는 것은 시장 선두주자로서 긍정적인 영향을 줄것이다.

 

Besides, Samsung's decision to incorporate its double-stack technology into its 176-layer 3D NAND manufacturing processes could speed up its transition to the 200-plus-layer generation and help widen its technological lead over competitors, the sources said.

 

 

Japan's Kioxia (formerly Toshia Memory) has again postponed its planned IPO. The company "was aiming to IPO at the appropriate time," a Reuters report quoted a Kioxia spokesperson as saying.

 

Nevertheless, Kioxia could be among the beneficiaries of the Japan government's planned JPY774 billion (US$6.8 billion) in funding for domestic semiconductor investment, according to industry sources. Government subsidies may help Kioxia carry out its expansion project in Kitakami, Iwate Prefecture where a new K2 fab will be establish. Kioxia operates K1, a 3D NAND flash fab, at the site.

 

Kioxia has not disclosed plans for its transition to 200-plus-layer 3D NAND process manufacturing, but has announced its joint development with Western Digital of 162-layer 3D NAND. Market watchers expect Kioxia to have 162-layer 3D NAND manufacturing process as its mainstream between 2022 and 2023.

 

 

SK Hynix is expected to put increased focus on enterprise storage applications after completing its acquisition of Intel's NAND memory and storage business at the end of 2021, according to industry sources. Intel has reportedly adopted double-stack method in its 3D NAND flash manufacturing, which will advance to 196 layers in 2023, the sources said.

 

 

Micron earlier in January 2022 announced it had kicked off volume shipments of what the company claims is the industry's first 176-layer QLC NAND SSDs. The US vendor said previously it would be striving to capture a larger share of the overall industry's profit pool rather than growth in its share of industry production volume.

 

 

China's Yangtze Memory Technologies (YMTC), despite its late entry into the NAND flash market, is making progress in improving its manufacturing yield rates for 128-layer 3D NAND flash. YMTC has boosted yield rates for 64-layer 3D NAND flash manufacturing to mature levels, according to industry sources in China.

 

중국의 양츠메모리(YMTC)는 낸드 시장에 늦게 진입했음에도 불구하고 128단 3D낸드의 생산 수율이 향상되고 있다.

64단 낸드의 수율도 성숙 수준으로 증가하고 있다고 산업관계자는 분석했다.

 

YMTC is on track to meet its goal of scaling up monthly output to 100,000 wafers in the first half of 2022, the sources said. The chipmaker is striving to enter the supply chain of China's first-tier brand vendors and extend its target markets to include handset and PC applications.

 

중국의 YMTC는 2022년 상반기에 월10만장 규모의 생산을 목표로 준비중이다.

이 회사는 중국 일류 제조사의 공급망에 들어가려고 노력중이고, 목표를 핸드폰과 PC부문으로

넓히고 있다.

 

According to ChinaFlashMarket, the global NAND flash market will rise at a CAGR of 30% from 2020 to 2025, while the datacenter segment will grow by a larger 39% CAGR over the five years.

 

차이나 플래시마켓에 따르면, 글로벌 낸드 시장은 2020년에서 2025년까지 연율로 30%씩 성장할 것이고,

데이터센터부문은 동 기간 39%씩 성장할 것으로 분석했다.